schottky rectifier diode semelab limited reserves the right to change test c onditions, parameter limits and package dimensions without notice. information furnished by semelab is believed to be both accurate and reliable at the time of going to press. however semelab assumes no responsibility for any errors or omissions discovered in its use. semelab encourage s customers to verify that datasheets are current before placing o rders. semelab limited semelab limited semelab limited semelab limited coventry road, lutterworth, leicestershire, le17 4 jb telephone +44 (0) 1455 556565 fax +44 (0) 1455 5526 12 email: sales@semelab-tt.com website: http://www.semelab-tt.com document number 8318 issue 4 page 1 of 4 1N5806D2 variant options d2a to d2h ? hermetic ceramic package designed as a drop- in replacement for d-5a melf package ? designed for high rel applications ? screening options available absolute maximum ratings (t a = 25c unless otherwise stated) v rrm maximum reverse repetitive peak voltage 150v v rms maximum rms voltage 105v v dc maximum dc blocking voltage 150v i o maximum rectified current i o2 = t a +55c (1) 1.0a derate above t a 55c 8.33ma/c i fsm non repetitive forward surge current (2)(3) 35a t j junction temperature range -65 to +175c t stg storage temperature range -65 to +175c thermal properties symbols parameters max. units r jsp(in) thermal resistance, junction to solder pads t sp =25c 34 c/w r ja(pcb) thermal resistance, junction to ambient (3) 150 c/w notes notesnotes notes (1) i o2 is rated at 1.0a @ t a = 55 c for pc boards where thermal resistance from mount ing point to ambient is sufficiently controlled whe re t j (max) does not exceed 175 c; this equates to r ja(pcb) 154c/w. (2) t a = 25 c @ io=1.0a and vrwm for ten 8.3ms surges at 1 minu te intervals. (3) pcb = fr4, 0.0625 inch (1.59mm) thick, single lay er, 1.0-oz cu, pad size, (0.067? x 0.105?)?, (1.7m m x 2.76mm) ?, horizontal in still air. ? recommended solder pad layout dimensions for this device, as detailed within this datasheet for the d-5a device.
schottky rectifier diode 1N5806D2 semelab limited semelab limited semelab limited semelab limited coventry road, lutterworth, leicestershire, le17 4 jb telephone +44 (0) 1455 556565 fax +44 (0) 1455 5526 12 email: sales@semelab-tt.com website: http://www.semelab-tt.com document number 8318 issue 4 page 2 of 4 electrical characteristics (t c = 25c unless otherwise stated) symbols parameters test conditions min typ max unit s v f (4) forward voltage i fm = 1.0a 0.875 v t a = 125c 0.800 t a = -65c 1.075 i fm = 2.5a 0.975 i r (4) reverse current v r = 150v 1.0 a t a = 125 c 175 v br (4) breakdown voltage i br = 100a 160 v t a = -65c 150 dynamic characteristics (t c = 25c unless otherwise stated) t rr reverse recovery time i f = i rm = 0.5a i (rec) = 0.05a 25 ns di/dt = 65a/s c j capacitance v r = 10v v sig = 50mv 25 pf f = 1.0mhz notes notesnotes notes (4) pulse width 380us, 2%
schottky rectifier diode 1N5806D2 semelab limited semelab limited semelab limited semelab limited coventry road, lutterworth, leicestershire, le17 4 jb telephone +44 (0) 1455 556565 fax +44 (0) 1455 5526 12 email: sales@semelab-tt.com website: http://www.semelab-tt.com document number 8318 issue 4 page 3 of 4 dimension mm inches a 6.25 0.246 b 1.70 0.067 c 2.67 0.105 dlcc2 variants a, c, d, e variant d2a au plated terminals d2c tape & reel option d2d hot solder dipped terminals d2e hot solder dipped terminals & tape & reel option pin out pad 1 anode pad 2 cathode dimension mm inches a 5.00 0.10 0.197 0.004 b 2.61 0.10 0.103 0.004 c 1.08 0.10 0.043 0.004 d 1.76 0.10 0.069 0.004 dlcc2 variants b, f, g, h variant d2b au plated terminals d2f tape & reel option d2g hot solder dipped terminals d2h hot solder dipped terminals & tape & reel option pin out pad 1 anode pad 2 cathode pad 3 lid contact to cathode* dimension mm inches a 5.00 0.10 0.197 0.004 b 2.61 0.10 0.103 0.004 c 1.08 0.10 0.043 0.004 d 1.76 0.10 0.069 0.004 mechanical data * the additional contact provides a connection to t he lid in the application. connecting the metal lid to a known electrical potential stops deep dielectric discharge in space applications; see the space weather link www.semelab.co.uk/mil/dlcc2 on the semelab web site. the package variant & options are to be specified when placing the order. ? the dlcc2 package design takes full advantage of t he proven high reliability pedigree of the htcc sur face mount packaging technology, which is easily integrated for automated assembly. semelab has taken the existing standards for ceram ic surface mount package manufacture and added additional design features to enhance the rmal performance, to present a competitive alternat ive for high reliability applications. solder pad layout d-5a soldering temperature should be 260c for a maximum of 10 seconds. the physical dimensions for the dlcc2 ceramic packa ge are designed to be different from the published dimensi ons for the ?d- 5a? and ?b-melf? outlines. the dlcc2 design fully utilises the recommended solder footprint for the ?d-5a? / ?b-me lf? package, and as such presents a drop in replacement for existing board designs. package mass gold plated solder pad finish = 83mg a b c dlcc2/ d-5a melf overlay
ultrafast recovery rectifier diode 1N5806D2 semelab limited semelab limited semelab limited semelab limited coventry road, lutterworth, leicestershire, le17 4 jb telephone +44 (0) 1455 556565 fax +44 (0) 1455 5526 12 email: sales@semelab-tt.com website: http://www.semelab-tt.com document number 8318 issue 4 page 4 of 4 screening option space level (jqrs/esa) and high reliability options are available in accordance with the high reliability and screening options handbook available for download from the from the tt electronics semelab web site. esa quality level products are based on the testing procedures specified in the generic escc 5000 and i n the corresponding part detail specifications. semelabs qr216 and qr217 processing specifications (jqrs), in conjunction with the companies iso 9001: 2000 approval present a viable alternative to the americ an mil- prf-19500 space level processing. qr217 (space level quality conformance) is based on the quality conformance inspection requirements of mil- prf- 19500 groups a (table v), b (table via), c (table vii ) and also esa / escc 5000 (chart f4) lot validation test s. qr216 (space level screening) is based on the scree ning requirements of mil-prf-19500 (table iv) and also es a /escc 5000 (chart f3). jqrs parts are processed to the device data sheet a nd screened to qr216 with conformance testing to q217 groups a and b in accordance with mil-std-750 metho ds and procedures. additional conformance options are available, for e xample pre-cap visual inspection, buy-off visit or data pac ks. these are chargeable and must be specified at the o rder stage (see ordering information). minimum order quantities may apply. alternative or additional customer specific conform ance or screening requirements would be considered. contact semelab sales with enquires. marking details parts can be laser marked with approximately 7 char acters on two lines and always includes cathode identifica tion. typical marking would include part or specification number, week of seal or serial number subject to available space and legibility. customer specific marking requirements can be arran ged at the time of order. example marking: ordering information part numbers are built up from type, package variant , and screening level. the part numbers are extended to i nclude the additional options as shown below. type ? see electrical characteristics table package variant ? see mechanical data screening level ? see screening options (esa / jqrs ) additional options: customer pre-cap visual inspection .cvp customer buy-off visit .cvb data pack .da solderability samples .ss scanning electron microscopy .sem radiography (x-ray) .xray total dose radiation test .rad mil-prf-19500 (qr217) group b charge .grpb group b destructive mechanical samples .gbdm (12 pi eces) group c charge .grpc group c destructive electrical samples .gcde (12 pi eces) group c destructive mechanical samples .gcdm (6 pie ces) esa/escc lot validation testing (subgroup 1) charge .lvt1 lvt1 destructive samples (environmental) .l1de (15 pieces) lvt1 destructive samples (mechanical) .l1dm (15 pie ces) lot validation testing (subgroup 2) charge .lvt2 lvt2 endurance samples (electrical) .l2d (15 pieces ) lot validation testing (subgroup 3) charge .lvt3 lvt3 destructive samples (mechanical) .l3d (5 piece s) additional option notes: 1) all ?additional options? are chargeable and must be specified at order stage. 2) when group b,c or lvt is required, additional el ectrical and mechanical destructive samples must be ordered 3) all destructive samples are marked the same as o ther production parts unless otherwise requested. example ordering information: the following example is for the 1n5806 part with p ackage variant b, jqrs screening, additional group c confo rmance testing and a data pack. part numbers: 1N5806D2b-jqrs (include quantity for flight parts) 1N5806D2b-jqrs.grpc (chargeable conformance option) 1N5806D2b-jqrs.gcde (charge for destructive parts) 1N5806D2b-jqrs.gcdm (charge for destructive parts) 1N5806D2b-jqrs.da (charge for data pack) customers with any specific requirements (e.g. mark ing or screening) may be supplied with a similar alternati ve part number (there is maximum 20 character limit to part numbers). contact semelab sales with enquiries. high reliability and screening options handbook lin k: http://www.semelab.co.uk/pdf/misc/documents/hirel_ and_screening_options.pdf
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